柠檬酸钠对电解抛光金属钨的影响

Effect of sodium citrate on electrolytic polishing of tungsten

采用硫酸-甲醇-柠檬酸钠电解液体系对金属钨进行电解抛光。通过改变柠檬酸钠的浓度,采用电子扫描电镜和原子力显微镜分析电解抛光金属钨试样表面的微观形貌和表面粗糙度的变化规律,探究柠檬酸钠在钨电解抛光的作用机理。结果表明,在电解液中柠檬酸钠浓度为0.25mol/L时试样获得最小的表面粗糙度和较好表面形貌。

In this paper, a sulfuric acid-methanol-sodium citrate system that can be used to polish tungsten alloys was studied. By changing the concentration of sodium citrate, the microscopic morphology and surface roughness of the surface of the electropolished metal tungsten sample were analyzed by scanning electron microscopy and atomic force microscopy to investigate the mechanism of action of sodium citrate in tungsten electropolishing. When the concentration of sodium citrate is low, the effect of electrolytic polishing is not obvious. When the concentration of sodium citrate is too high, the electrolytic polishing excessively destroys the surface. The results showed that the sample had the smallest surface roughness and good surface morphology when the concentration of sodium citrate in the electrolyte was 0.25 mol/L under the condition of 20 ℃,22 V and 7 minutes polishing time. Tt showed that moderate amount of sodium citrate made a positive effect on electrolytic polishing.