移动通信用PCB精细线路制作工艺研究

4G及5G移动通信信号传输频率与传输速率不断提高,对印制电路板中负责信号传输的线路精细程度、线路长度及线路密度之要求也日益严苛。为满足移动通信对高性能印制电路板的要求,文章开发出了一种新的半加成法技术,用以制作精细线路。结果表明,这种新的半加成法能够避免磁控溅射、化学镀铜以及减薄铜等传统半加成制作方式的缺陷,获得适用于移动通信的精细线路。

With the increasing frequency and transmission rate of 4G and 5G mobile communication signals, the requirements of line fineness, line length and line density for signal transmission in printed circuit board （PCB） are becoming more and more stringent. In order to meet the requirements of mobile communication for high performance printed circuit board （PCB）, a new semi-addition technique is developed to fabricate fine circuit. The results show that the new semi-addition method can avoid the defects of traditional half-addition methods such as magnetron sputtering, electroless copper plating and thinning copper, and obtain fine circuits suitable for mobile communication.