真空辅助RTM环氧树脂性能的研究

Study on performance of epoxy resin for vacuum assisted RTM

以低黏度环氧树脂为基体树脂、耐高温的胺类为固化剂,制备了一种真空辅助树脂传递模型(RTM)环氧树脂体系,研究了其黏度特性、树脂的固化反应热和力学性能等。结果表明,我们研发的环氧树脂体系的凝胶时间、固化温度和后处理温度分别为53.2℃、87.39℃和127.7℃。该体系的黏度、凝胶时间、耐热性和高温固化后的力学性能均适合真空辅助RTM成型。

Using a epoxy resin with low viscosity as the matrix resin and a alicyclic amine with high temperature resistance as the curing agent, a epoxy resin system for the vacuum assisted RTM （resin transfer molding） was prepared. The viscosity, curing reaction heat and mechanical properties of the resin system were investigated. The results show that the gel time of the system is 53.2℃, the curing temperature is 87.39℃, and the temperature of post-treatment is 127.7℃. The viscosity, gel time, heat resistance and the mechanical properties after curing are all suitable for the vacuum assisted RTM.