机载平视显示器数字像源背光组件设计

Design of digital image source backlight assembly for airborne head-up display

随着COB封装技术发展,采用LED芯片构建液晶显示器背光组件成为一种新的思路;提出了LED芯片COB板结合配光透镜阵列的透镜阵列型COB新颖背光组件;通过LIGHTTOOLS软件构建了3.8Inch机载平视显示器数字像源背光组件模型,仿真分析照度均匀性达到98%,空间亮度均匀性超过85%,光能利用率超过90%。与LED芯片COB板背光组件、及机载平视显示器正用数字像源LED灯珠阵列背光组件照度、空间亮度和强度视角分布进行了仿真对比,在同样输出3150Lumen情况下,透镜阵列型COB背光组件照度超过6.6×10-5 Lux、空间亮度接近2.0×10-6 Nit,远远超过其他两种背光形式,同时保持了与LED灯珠阵列背光基本相同的视角包络。

With the development of COB packaging technology,it is a new idea to build LCD backlight assembly directly using LED chips.A novel Lens array COB backlight assembly is proposed,which is composed of COB LED chip board and light distribution lens array.The 3.8-inch digital image source backlight assmbly model of airborne head-up display（HUD）is constructed by LIGHTTOOLS software.Simulation analysis shows that the illumination uniformity is up to 98%,the spatial brightness uniformity is over 85%,and the utilization rate of light is more than 90%.Compared with LED chip COB board backlight assembly and existing HUD LED lamp array backlight assembly in illuminance,spatial luminance and intensity distribution,finding in the case of the same output 3150 lm,the lens array COB backlight assembly illumination is more than 660000 cd/m-2,the spatial brightness is close to 2000000 nit,which is far more than the other two forms of backlight,while maintaining the same intensity distribution envelope with existing HUD LED lamp array backlight assembly.