软包装行业的新发展：在无溶剂复合中引入激光模切

Introducing Laser Die-Cutting while Solvent Less Laminating, a New Development for Flexible Packaging

本文详细介绍了将激光模切系统集成到无溶剂复合机当中，在线实现“模切＋复合”的工艺。该工艺可以将“纸塑复合＋开窗”两个工序在无溶剂复合机上同步完成。

This paper introduces Laser technology integrating a laser die cutting system into a laminator to allow for an in line, achieving ＂die cutting ＋ lamination＂ online. The process can simultaneously complete the two processes of ＂paper-plastic composite ＋ window opening＂ on a solventless laminating machine.