摘要
基于微加工技术设计制备了一种微机电系统(MEMS)薄膜热流传感器。采用COMSOL软件,对不同结构参数MEMS薄膜热流计进行仿真模拟,通过对仿真结果对比和分析,优化热流传感器的设计参数。根据优化的设计参数利用MEMS工艺制备薄膜热流计。搭建了标定系统,对所制备的MEMS薄膜热流计进行性能测试和标定。实验结果表明:薄膜热流计的电压输出响应曲线的变化趋势和仿真结果一致,此外,薄膜热流计的输出电压和热流密度呈良好的线性关系。
Based on micromachining technology,a micro-electro-mechanical system(MEMS)thin-film thermopile(TFTP)heat flux senor is designed and fabricated.The property of TFTPs with different structure is modeled and analyzed by FEA COMSOL in order to obtain the best sensor performance with a smaller device dimensions.The MEMS TFTPs are proposed and manufactured based on the optimized design.The testing system has been built to characterize the performance of fabricated TFTPs.It can be found that the output voltage responses are consistent with simulation results when a step heat flux applied.The test results also show that the output voltage of TFTPs responded linearly with heat flux.
作者
李娟
张丛春
杨申勇
丁桂甫
董威
段力
LI Juan;ZHANG Congchun;YANG Shenyong;DING Guifu;DONG Wei;DUAN Li(National Key Laboratory of Science and Technology on Micro/Nano Fabrication,Shanghai Jiao Tong University,Shanghai 200240,China;Department of Micro/Nano Electronics,School of Electronic Information and Electrical Engineering,Shanghai Jiao Tong University,Shanghai 200240,China;School of Mechanical Engineering,Shanghai Jiao Tong University,Shanghai 200240,China)
出处
《传感器与微系统》
CSCD
2019年第5期71-73,共3页
Transducer and Microsystem Technologies
关键词
微机电系统技术
热流传感器
聚酰亚胺
COMSOL仿真
micro-electro mechanical system(MEMS)technology
heat flux senor
polyimide
COMSOL simulation
