脉冲电流密度对磁控溅射制备TiN薄膜组织与性能的影响

Effect of Pulse Current Density on Microstructure and Properties of TiN Films Prepared by Magnetron Sputtering

为提高TiN薄膜的沉积质量,采用双脉冲磁控溅射方法制备了TiN薄膜,通过对薄膜的形貌、结构和力学性能的分析,探讨了不同脉冲电流密度制备的TiN薄膜的组织形态及其力学特性。结果表明:不同脉冲电流密度下制备的TiN薄膜试样的颗粒尺寸都在200 nm以下,脉冲电流密度上升到0.40 A/cm^2时,锥形颗粒基本都转变成了圆胞形结构,沉积速率也表现出减小的变化;当脉冲电流密度为0.80 A/cm^2时,制得的TiN薄膜各项力学特性及其抗弹性变形能力都达到最佳状态;脉冲电流密度上升后,会使薄膜致密度随之上升,当形成的薄膜组织具有更大的致密度时,可以使其力学强度得到提升。

By means of pulsed magnetron sputtering,TiN thin films were prepared.The off-target process of plating particles under different peak currents and the microstructure and mechanical properties of TiN thin films were investigated.Results showed that the particle size of TiN thin film samples was less than 200 nm.When the peak target current increased to 0.40 A/cm^2,the original conical particles were basically transformed into a circular cell structure,and the deposition rate also showed a decreasing change.When the peak target current was equal to0.80 A/cm^2,the mechanical properties and the elastic deformation resistance of TiN thin films reached the optimal state.When the peak target current increased,the density of the thin film would increase accordingly.When the formed thin film tissue had a greater density,its mechanical strength could be improved.