大功率LED金属封装工艺研究分析

High power LED metal encapsulation process analysis

考虑到大功率LED热效应对其性能和使用寿命具有直接影响,大功率LED都具有复杂的封装结构和封装工艺。同时,大功率LED的热效应和封装工艺研究一直是LED领域的研究热点问题。本文在研究大功率LED金属封装工艺技术的基础上,从金属热效应方面详细讨论大功率LED封装的研究进展和工艺改进。

Considering the high power LED heat effect has a direct influence on the performance and service life, high power LED has complicated structure and packaging process. At the same time, the heating effect of the high power LED and encapsulation technology research hot topic in the field of research has been LED. In this paper, based on the study of the high power LED metal packaging technology, discussed in detail from the aspects of metal heating the research progress of high power LED packaging and process improvement.