间歇式电镀法制备核壳结构钨铜包覆粉体的研究

Copper-Coated Tungsten Powders with Core-Shell Structure Prepared by Intermittent Electrodeposition

钨铜复合材料因低膨胀系数、高导热性,可有效传输集成电路产生的热量,从而延长电路的使用寿命。铜包覆钨复合粉体有利于钨铜复合材料的综合性能的提高。采用间歇式电镀法成功制备出钨铜包覆粉体,研究了不同电镀时间对复合粉体表面形貌、镀层厚度、含铜量以及铜镀层沉积速率的影响以及铜镀层的形成机理。结果表明,制备出的复合粉体为铜包钨核壳结构,铜镀层均匀、致密,表面粗糙度小;在电流密度为1.7 A/dm^2的条件下,电镀30和75 min的平均镀层厚度分别为0.69和1.96μm,含铜量分别为9.97%和23.76%,沉积速率分别为36.91和41.34 mg·min^(-1),镀层厚度、沉积速率均随电镀时间的增加而增加;铜镀层的形核和长大遵循Volmer-Weber模式。

Due to low coefficient of thermal expansion and high thermal conductivity, tungsten-copper composites can effectively transmit heat generated by the integrated circuit, thus prolonging the life of the circuit. Copper-coated tungsten composite powders help to improve the overall performance of tungsten-copper composites. Copper-coated tungsten powders were prepared by intermittent electrodeposition. The effects of different plating time on composite powder surface morphology, thickness, copper content and copper plating deposition rate were investigated, and simultaneously the formation mechanism of copper plating layer was also studied. The analysis results show that tungsten copper composite powders prepared by intermittent electrodepositon are the core-shell structure of copper-coated tungsten, the copper coating is uniform, dense, and the surface roughness is small; in the conditions of current density 1.7 A/dm^2, the average coating thickness is 0.69 and 1.96 μm, copper content 9.97% and 23.76%, deposition rate 36.91 and 41.34 mg·min^(-1) when electroplated for 30 and 75 min, respectively. Coating thickness and deposition rate increase with the increase of plating time; the copper plating layer nucleation and growth follow the Volmer-Weber mode.