多层陶瓷电气互连可靠性及工艺优化

Reliability and Process Optimization of Multilayer Ceramic Electrical Interconnection

针对多层陶瓷电气互连工艺对应力大小及分布特性的影响作用及由此带来的相关效应,采用有限元分析软件ANSYS WORKBENCH,建立多种多层垂直互连通孔极端边界模型,对低温共烧陶瓷(Low temperature co-firing ceramic,LTCC)制作过程中互连通孔失效所产生的应力问题以及高密互连通孔中相邻孔距之间的应力情况进行分析,并针对其烧结过程的热应力进行仿真,研究影响LTCC互连可靠性的关键因素,提出改善LTCC无源集成互连可靠性的工艺优化方法。

To study the influence and related effects of multilayer ceramic electrical interconnection process for stress magnitude and distribution properties, this paper used finite element analysis software ANSYS WORKBENCH to establish a variety of multi-storey vertical interconnect vias extreme boundary model. The invalid stress problems of interconnecting vias and the stress of high-density adjacent pitch between interconnect vias were analyzed, and the thermal stress in the sintering process was simulated. Furthermore, the key factors which can influence the reliability of the low temperature co-firing ceramic(LTCC) interconnection via were discussed, and the optimization methods for improving the process reliability of the LTCC passive integrated interconnection via were proposed.