低温弹性环氧树脂的固化反应及热机械特性（英文）

Curing Reaction, Thermal and Mechanical Properties of Low-Temperature Elastic Epoxy Resin

四氢呋喃共聚醚改性低温环氧树脂胶是红外焦平面探测器中一种理想的底充材料。通过混合弹性环氧树脂和一定量的固化剂制得这种树脂胶。采用动态热机械分析仪(DMA)在不同的测试模式和温度条件下,对样品的热机械性能进行了系统分析。通过在拉伸形变模式下对样品施加逐渐递增的静态力获得了应力-应变曲线,运用线性拟合分析了不同样品的弹性模量差异。在动态温度扫描模式下,通过损耗角正切的峰值来间接标定样品的玻璃态转变温度(Tg),相应的值分布在30℃到50℃范围内。DMA方法能够有效地用来模拟实际变化的温度环境,并且及时记录相关的测试数据,这将有利于焦平面红外探测器中芯片失效机理的研究。

As the desired underfill material for the application in the infrared focal plane detector(IRFPA), the low-temperature epoxy resin glue with tetrahydrofuran(THF) copolyether modification was prepared by mixing modified epoxy resin and a certain amount of curing agent. The thermal and mechanical properties of the cured samples were analyzed using dynamic mechanical analysis(DMA) with different testing modes and temperature condition. Discrepancies of elastic modulus were found through the liner fitting to strain-stress curves, which were measured by tensile loading fixture with a gradually increased static force. As a dynamic test, temperature scanning mode was employed to characterize the glass transition temperature(Tg) of final samples, with which related data ranged from 30 to 50 °C was indirectly obtained from the value of damping parameter peak position. DMA methods could be efficiently used to simulate the practically changed temperature environment and timely record the testing data, which is significant for studying the chip failure mechanism in IRFPA.