不同厚度电解铜箔的组织与性能研究

Microstructure and Properties of Electrolytic Copper Foil with Different Thicknesses

通过调整电沉积时间,控制其它电解工艺参数恒定不变,制备了不同厚度的电解铜箔。利用SEM、XRD、EBSD、万能试验机等研究了不同厚度电解铜箔表面形貌、织构、尺寸效应及断裂机制对其拉伸性能的影响,结果表明,随着电沉积时间的增加,铜箔厚度增加,铜箔表面颗粒增大,晶面取向由{111}、{220}、{311}等织构逐渐演变为{220}强择优取向。铜箔厚度小于18μm时,极薄铜箔由于尺寸效应,抗拉强度和延伸率随铜箔厚度增加而增加。铜箔厚度大于18μm时,随着铜箔厚度增加,晶粒尺寸变大和晶面取向的高择优程度会降低铜箔抗拉强度。

Electrolytic copper foils with different thicknesses were prepared by adjusting the electrodeposition time and controlling other electrolytic parameters to be constant.SEM,XRD,EBSD,and universal testing machine were used to research the effects of surface morphology,texture,size effect and fracture mechanism on the tensile properties of electrolytic copper foil with different thicknesses.The results show that with the increase of electrodeposition time,the grain size of the surface increases,and the orientation of the crystal plane{220}becomes stronger.When the copper foil thickness is less than 18μm,the tensile strength and elongation of the ultra-thin copper foils increase with the thickness of the copper foil increasing due to the size effect.However,when the thickness of the copper foil is more than 18μm,as the thickness of the copper foil increases,the grain size becomes larger and the degree of crystal plane orientation becomes higher,which reduces the tensile strength of the copper foil.