摘要
为提高陶瓷金属化层的焊接性能 ,提出了一种陶瓷二次金属化镀镍工艺。介绍了镀镍液的配方、工艺条件及具体工艺流程。探讨了镀镍层常见缺陷的原因并提出了解决方法。
In view of the poor solderability of metallic film formed on ceramic surface, a secondary metallization of ceramic surface by nickel plating was advanced. Formula, plating parameters and detailed procedures of the process were described. Causes for defective nickel deposits were discussed and solutions were presented.
出处
《电镀与涂饰》
CAS
CSCD
2002年第4期23-25,共3页
Electroplating & Finishing
