一种大功率LED车灯光源的开发与研究

Development and Research of a High-Power LED Automobile Lamp

针对卤素灯使用寿命短、发光效率低等缺点,基于热电分离式理念设计出一种新型金属基板(MCPCB,Metal Core Printed Circuit Board),并将其与25W的LED灯珠组装成模组之后开发出一款大功率LED车灯光源。同时,利用红外线成像仪及积分球系统对相同功率的卤素车灯与LED车灯的发光表面温度以及光学特性进行了对比研究。结果表明,当环境温度为25±1℃时,卤素灯表面最高温度大于350℃,而LED车灯表面最高温度仅为127℃;当LED能耗为卤素灯的56.64%时,其对应的光学特性指标,如光通量、光功率及光效分别为后者的3.67倍、1.74倍、6.52倍,表现出强大的性能优势。

In order to address the shortcomings such as short lifetime and insufficient luminousefficiency of halogen lamp, a novel MCPCB(Metal Core Printed Circuit Board)in light of thermoelectric separation concept was designed and fabricated. This new MCPCB was then mounted with 30 W LED for the preparation of LED module which was later turned into a high-power LED automobile lamp. Meanwhile, the luminous surface temperature and optical characteristic of the above mentioned LED automobile lamp and halogen lamp of the same power were investigated for a comparativestudy. It was found that the highest luminous surface temperature of halogen lamp was more than 350℃ and that of LED automobile lamp was 127℃;When the energyconsumption of LED automobile lamp was only 47.04% of that of the halogen lamp, its opticalperformances such as luminous flux, luminous power and luminous efficiency were 2.7 times, 1.45 times and 5.62 times as much as that of the counterpart.