阳极连接电流峰的一种可能机制

A Possible Mechanism for Current Peak during Anodic Bonding

待连接表面间的紧密接触是实现阳极连接的必要条件 ,因此分析紧密接触面积演化特点非常重要。本文借助等效电路法 ,考虑玻璃弹性形变及阳极表面二维不平整度 ,计算了紧密接触面积和连接电流强度。结果表明 ,紧密接触面积经过一孕育期后迅速扩大 ,在待连接表面边缘扩展速率显著下降 ,连接电流存在一峰值。

The intimate contact of two surfaces to be bonded is a prerequisite for the anodic bonding, therefore, it is very important to analyze evolution characters of the intimate contact area. Based on the method of equivalent electrical circuit, the paper calculates the intimate contact area and the bonding electrical current, taking into account elastic deformation of glass and two-dimensional roughness of the anode. Results show that the intimate contact area spreads rapidly after an incubation period and the spreading velocity drops at the edge of the surfaces to be bonded. There is a peak for the anodic bonding current.The current peak results from the competence of current decay due to electric field and current increase due to the spread of intimate contact area.