期刊文献+

外加磁场对Sn-9Zn钎料组织、熔化温度及腐蚀性能影响 被引量:2

The Effects of Magnetic Field on Microstructure,Molten Temperature and Corrosion of Sn-9Zn Solder
下载PDF
导出
摘要 运用X射线衍射仪、扫描电镜、金属腐蚀检测仪等仪器设备,研究0.5 T外加磁场作用对Sn-9Zn钎料合金组织、熔化温度及腐蚀性能影响。研究结果表明,外加磁场可促进Sn-9Zn钎料合金显微组织细化,熔化温度下降近2℃,腐蚀性能得到改善,分析认为,由于外加磁场可促进Sn-9Zn钎料合金在特定晶面迅速结晶形核,抑制Zn富相形成,从而细化Sn-9Zn钎料组织以及影响钎料合金的熔化温度及腐蚀性能。 Effects on microstructure,molten temperature and corrosion of Sn-9Zn solder alloy was researched under magnetic field of 0.5 T by means of XRD,SEM and metal corrosion detecter etc.The results show that magnetic field can refine microstructure of Sn-9Zn solder alloy,molten temperature decrease by 2 ℃ and corrosion improve as well.It can be concluded that the magnetic field can promote Sn-9Zn solder to crystalize at special plane and restrict formation of rich-Zn phase,which refine microstructure of Sn-9Zn solder and improve its property.
作者 吴敏
出处 《石油化工高等学校学报》 CAS 2010年第2期80-83,共4页 Journal of Petrochemical Universities
基金 辽宁省教育厅科学研究计划资助项目(2008382 20060505)
关键词 磁场 SN-9ZN钎料 组织 熔化温度 腐蚀性 峰值强度 Magnetic field Sn-9Zn solder Microstructure Molten temperature Corrosion Intensity peak
  • 相关文献

参考文献10

  • 1修岩,吴敏.微量铅对Sn-9Zn合金钎料性能的影响[J].辽宁石油化工大学学报,2009,29(2):36-38. 被引量:3
  • 2赵杰,朱凤,尹德国,王来.强磁场下Sn-3Ag-0.5Cu/Cu界面金属间化合物生长行为[J].大连理工大学学报,2006,46(2):202-206. 被引量:8
  • 3Alireza Radjai,Kenji Miwa.Effects of the intensity and frequency of electromagnetic vibrations on the microstructural refinement of hypoeutectic Al-Si alloys[J]. Metallurgical and Materials Transactions A . 2000 (3)
  • 4W. Q. Zhang,Y. S. Yang,Q. M. Liu,Y. F. Zhu,Z. Q. Hu.Structural transition and macrosegregation of Al-Cu eutectic alloy solidified in the electromagnetic centrifugal casting process[J]. Metallurgical and Materials Transactions A . 1998 (1)
  • 5Charles Vivès.Effects of forced electromagnetic vibrations during the solidification of aluminum alloys: Part II. solidification in the presence of colinear variable and stationary magnetic fields[J]. Metallurgical and Materials Transactions B . 1996 (3)
  • 6M. McCormack,S. Jin,H. S. Chen,D. A. Machusak.New lead-free, Sn-Zn-In solder alloys[J]. Journal of Electronic Materials . 1994 (7)
  • 7McCormack M,Jin S,Chen H S,et al.New lead-free Sn-Zn-In solder alloys. Journal of Electronic Materials . 1994
  • 8Suganuma K,Nakamura Y,Niihara K.Wetting and interface microstructure between Sn-Zn binary alloys and Cu. Journal of Materials Research . 1998
  • 9R. A. Islam,B. Y. Wua,M. O. Alam, et al.Investigations on microhardness of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder. Journal of Alloys and Compounds . 2005
  • 10ZHANG W Q,YANG Y S,ZHU Q M,et al.Structural transition and macrosegregation of Al-Cu eutectic alloy solidified in the electromagnetic centrifugal casting process. Metallurgical and Materials Transactions . 1998

二级参考文献18

  • 1任晓雪,李明,毛大立.合金元素对Sn-Zn基无铅钎料高温抗氧化性的影响[J].电子元件与材料,2004,23(11):40-44. 被引量:38
  • 2陈国海,黎小燕,耿志挺,马莒生.新型无铅焊料合金Sn-Zn-Ga的研究[J].稀有金属材料与工程,2004,33(11):1222-1225. 被引量:26
  • 3吴敏.Sn-9Zn合金无铅钎料用助焊剂研究[J].电子元件与材料,2006,25(9):43-45. 被引量:13
  • 4McCormack M,Jin S,Chen H S,et al. New lead-free Sn-Zn-In solder alloys[J].J. Electron Mater,1994,23 (9):1100--1102.
  • 5KIM K S,HUH S H,SUGANUMA K.Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints[J].J of Alloy and Compounds,2003,35(2):226-236.
  • 6LEE Y G,DUH J G.Phase analysis in the solder joint of Sn-Cu solder/IMC/Cu substrate[J].Mater Characterization,1999,42(2):143-160.
  • 7GOODMANN L S.Separation of molten axisymmetric solder joint[J].ASME J Electr Pack,1996,18(1):16-19
  • 8YOST B,MCGROARTY J,BORGESEM P,et al.Shape of nonaxisymmetric liquid solder drop constrained by parallel plates[J].IEEE-CHMT,1993,16(5):523-526.
  • 9MA Xin,WANG Feng-jing,WANG,Yi-yu,et al.Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface[J].Mater Lett,2003,57(22-23):3361-3365.
  • 10[日]长崎诚三,平林真.二元合金状态图集[M].刘安生译.北京:冶金工业出版社,2004:39.长崎诚三,平林真.

共引文献9

同被引文献14

引证文献2

二级引证文献5

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部