摘要
A simplified mathematical model was created for measurement of thermal expansion coefficients of thinsheet materials with holographic technique. Experimental set-ups corresponding to the mathematicalmodel were designed and built for both tests above room temperature and at low temperatures. Afringe control technique was introduced for low temperature measurements to compensate rigid bodymovement. Thin sheet specimens of silicon and aluminum alloy (7075) were tested with the developedtechnique. The tested results are in good agreement with reported data and thus verify the validityof the developed technique. The thermal expansion coefficients of the tested materials ranged from2.5×10-6C-1 to 23.6×0-60C-1.
