摘要
A new kind of thermosyphon heat sink has been studied and developed, its performance being measured.It was found that a remarkable boiling delay phenomenon occurs during its work. The phenomenon is described and explained and its effects on thermoresistance performance at both steady and transient states are discussed. The thermoresistance of this sink is found to be 0.029°C/W at air velocity 5m/s.This heat sink will satisfy the needs of cooling rectifier diodes and thyristors of rated currents up to 1000 amperes.
