摘要
论述了叠层片式电感的发展趋势。指出高频电感应用领域扩大,使用频率不断提高;高频电感尺寸进一步小型化;集成化趋势方兴未艾; 大电流与高频磁珠需求不断增加。
The development trend of chip multilayer inductors (MLCI) is reviewed. Chip inductors for high frequency application are more widely used. Of them, the working frequency is increasing and the size reducing. The demands for chip beads used in high speed signal and high current is increasing.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2002年第10期19-21,24,共4页
Electronic Components And Materials
关键词
叠层片式电感
发展趋势
磁珠
小型化
集成化
chip multilayer inductor
chip beads
miniaturization
integration
