不同添加剂对Ni-Sn-Mn合金电沉积行为的影响

Effect of Different Additives on Electrodeposition Behavior of Ni-Sn-Mn Alloy

采用阴极极化曲线、循环伏安曲线、电化学阻抗和电位阶跃等电化学方法,研究了糖精(BSI)、1,4-丁炔二醇(BYD)及两种添加剂组合对Ni-Sn-Mn合金电沉积行为的影响。结果表明:加入不同添加剂均使Ni-Sn-Mn合金电沉积的阴极极化增大,沉积电位负移,对合金电沉积起阻化作用;不同添加剂作用下电沉积过程均为不可逆;加入BSI的电荷转移电阻大于加入BYD的电荷转移电阻,而加入BSI+BYD的电荷转移电阻最大;在不同添加剂作用下Ni-Sn-Mn合金电沉积无因次曲线接近理论连续成核曲线,电沉积结晶过程遵循三维生长方式的连续成核机制。

The effect of benzosulfimide,1,4-butynediol and the additive compounded from benzosulfimide and 1,4-butynediol on electrodeposition behavior of Ni-Sn-Mn alloy was investigated by cathodic polarization curve,cyclic voltammetry curve,electrochemical impedance spectroscopy,and potential step.The results showed that the various additives could enhance the cathodic polarization,cause deposition potential to shift negatively and hinder the electrodeposition process.The electrodeposition process of Ni-Sn-Mn alloy with different additives was all irreversible.The charge transfer resistance of electrodeposition process by the actions of benzosulfimide was larger than that of 1,4-butynediol.The electrodeposition process by the actions of the additive compounded from 1,4-butynediol and benzosulfimide has the largest charge transfer resistance.The dimensionless curves of electrodeposition of Ni-Sn-Mn alloy by the actions of different additives was close to theoretical continuous nucleation curve.The electrocrystallization of Ni-Sn-Mn alloy in the presence of different additives followed the mechanism of continuous nucleation and three dimensional growth.