倒装芯片键合技术发展现状与展望

Summary of Flip Chip Bonding Technology and Equipment

我国集成电路发展十二五规划中提到,大力发展先进封装和测试技术,推进高密度堆叠型三维封装产品的进程,支持封装工艺技术升级和产能扩充。阐述了先进封装技术中的倒装芯片键合工艺现状及发展趋势,以及国际主流倒装设备发展及国内应用现状,重点介绍了北京中电科装备有限公司的倒装机产品。国产电子装备厂商应认清回流焊倒装芯片键合设备市场发展,缩短倒装设备产品开发周期和推向市场的时间,奠定国产电子先进封装设备产业化基础;同时抓紧研发细间距铜柱凸点倒装和热压焊接技术,迎接热压倒装芯片工艺及其设备的挑战。

China's ICdevelopm entTw elfth Five-Y ear Plan m entioned to develop advanced packaging and testing technology, prom ote the process of high-density stacked three-dim ensional packaging of products,and supportpackage technology upgrades and capacity expansion.This paper introduces the status and developm ent trends of the flip-chip bonding technology in the advanced packaging technology. The developm ent status of international flip chip bonder and dom estic applications are introduced.The flip chip bonder of B eijing Pow er Equipm entCo.,Ltd.is introduced.Itis concluded thatdom estic electronic equipm entm anufacturers should recognize the m arketof flip chip bonder by reflow process, and shorten product developm ent cycles. A t the sam e tim e, the dom estic electronics industry should grasp the chance of fine pitch copper pillar bum p and therm al com pression flip chip technology.