摘要
在集成电路封装过程中,引线框架作为主要的原材料,直接影响到IC产品封装的效率及可靠性,而引线框架的结构是影响效率及可靠性的关键。结合实际着重对引线框架机械结构:矩阵式IDF结构设计,外引线脚、基岛的锁定和潮气隔离结构,引线框架基岛结构设计三个方面做了详细的分析,阐述框架结构设计对产品高效率、高可靠性的贡献。
Leadfram e and its m echanical structure is one of the m ost im portant factors to product efficiency and reliability,Through detailed analysis of leadfram e m echanical structure,including m atrix ID F design,strong adhesion and anti-m oisture design on lead,and pad structure design,the benefits ofhigh efficiency and reliability to IC productare elaborated in this paper.
出处
《电子工业专用设备》
2014年第11期16-19,40,共5页
Equipment for Electronic Products Manufacturing
