机器视觉在焊点检测中的应用

Application of Inspect Ball Bonding with Machine Vision

阐述了利用图像处理的一些算法对半导体封装过程中的焊点进行检测,主要包括图像预处理、自动阈值图像分割、图像膨胀、空洞填充、图像连通、区域开圆运算、形状检测、计算区域特征等算法,并通过大量实验确定了参数,得到一种确实可行的应用方法完成焊点的检测。

This article introduces inspecting ball bonding with some Machine Vision algorithm on process of encapsulating semiconductor device,which mainly contain Image Pretreatment,Image Segmentation with auto threshold,Image expanding,File up hole,Image connection,Generate circle region,Inspect circularity shape,Calculate Circle radius. Then we can get a good method to achieve Inspecting ball bonding through make a lot of experiments to decide the parameter.