摘要
本文评述了三种高导热基板材料应用于混合微组件的可行性，并对热导率、热膨胀系数（CTE）、介电常数、抗弯强度等特性进行了详细介绍，比较了这些基板材料的优缺点。
This Paper reviews the feasibility of three high thermal conduchtvity materials applied for hybrid ndcmelectmeic assembIies, and suitable properties of theITnal conductivity, coefficient of thennal exPansion(ere), dielectric constant and flexure strength are discussed indetall. Both the advantages and disadvantages of these substrate materials are explained.
出处
《微电子技术》
1999年第1期44-48,共5页
Microelectronic Technology
关键词
混合电路
陶瓷
基板
热导率
Hybrid
Ceramic
Substrate
Thermal conductivity
