集成电路生产中成品率的有效管理

Effective Yield Management for Integrated Circuit Manufacturing

本文分析了在集成电路制造过程中，使用的基础材料、设备、工艺技术所产生的污染粒子，随机缺陷对IC产品成品率的影响。并主要介绍了从经典学习曲线概念中推导出来的成品率提高模型已被用于追踪产品成品率的提高，该模型建立在能优先迅速解决影响成品率诸多问题的基础上。实际成品率与模型化成品率的比较充分证明了成品率提高模型的实际意义。

In an integrated circuit manufacturing environment, the contaminative particles derived from the base material、tools、 process of application, and the effect of random de-fect on IC product yield are analyzed in this paper. It is maiap introduced uced that a yieldleaming medel derived dri the classical learning curve concept has been used for tmeingproduct yield learning. The model is hased on the prendse that yield leaming is best accom-plished hy prioritizing and qUickly resolving yield lindhng problems. A comParison of actualyield leaming to medeled yield leaming is presented to demonshate its usefulness.