摘要
根据最新的专利文献综述了高弧度、低弧度、高强度键合金丝的发展现状 ,介绍了微量添加元素的作用和Au -Cu -Ca、Au -Ag、Au -Ni、Au -Sn(In)、Au -Pt(Pd)等合金化键合金丝的研究动向 ,以及键合金丝的微量添加元素复合化、组成合金化、加工细线化、低成本化的发展趋势。
According to the new patents,development states of gold bonding wires used for IC?LSI was summarized.In the present paper,the new trends of alloying investigation for bonding wire,the effects of trace additive elements and properties of some new gold alloys such as Au-Cu-Ca,Au-Ag,Au-Ni,Au-Sn(In),?Au-Pt(Pd)and so on were introduced.
出处
《贵金属》
CAS
CSCD
2002年第3期57-61,共5页
Precious Metals
