摘要
相对于软X射线显微成像,硬X射线显微成像对菲涅尔波带片的吸收体厚度提出了更高的要求。采用电子束光刻和X射线光刻复制的方法,在聚酰亚胺薄膜上成功制作了高高宽比的菲涅尔波带片。首先利用电子束光刻和微电镀技术制作了X射线光刻的掩模,然后利用X射线光刻和微电镀制作了高高宽比、线条侧壁陡直的菲涅尔波带片。复制后的波带片最外环宽度500 nm,直径1 mm,吸收体金厚度为3.6μm,高宽比达到7.2,可用于10 keV^25 keV的硬X射线成像。
Compared to soft X-ray microscopy,Hard X-ray microscopy requires the absorber thickness of Fresnel zone plate more thicker.Electron beam lithography and Xray lithography were successfully combined to fabricate High-aspect-ratio X-ray focusing zone plates on polyimide membrane.In fabrication processes,firstly,a master mask was fabricated by electron beam lithography and gold electroplating;secondly,a volume of Fresnel zone plates with High-aspect-ratio and vertical cross-section profile were replicated by X-ray lithography and electroplating.Fresnel zone plates with 500 nm outermost zone width,1 mm diameter,3.6 μm gold thickness,and an aspect ratio high to 7.2 were successfully finished.The Fresnel zone plates can be used to focus hard X-ray with energy of 10 keV～25 keV.
出处
《微细加工技术》
2008年第6期9-11,共3页
Microfabrication Technology
基金
国家重大基础科学研究计划973项目资助(2007CB935302)
国家高技术研究计划863项目资助(2006AA03Z355)
国家自然科学基金资助项目(60676008)
关键词
菲涅尔波带片
硬X射线
X射线光刻
电子束直写
高高宽比
Fresnel zone plate
hard X-rays
X-ray lithography
electron beam lithography
high aspect ratio
