摘要
设计了一种低相位噪声毫米波平面振荡器电路,采用在振荡器谐振端嵌入缺陷接地结构(DGS)方法来改善振荡器的相位噪声;同时在振荡器混合集成中采用了芯片倒扣技术减小寄生效应。分析并比较了嵌入和未嵌入DGS结构两种振荡器电路的性能。测试结果表明,嵌入DGS结构的振荡器相位噪声比未嵌入的降低了5 dB^7 dB。
A millimeter-wave planar oscillator with low phase noise was designed.A new method that defected ground structure(DGS) was embedded into resonant terminal of oscillator was proposed for reducing the phase noise of oscillators.Flip chip technique was used in the hybrid integrated millimeter-wave oscillators too.The characteristics of two oscillators with and without DGS were analyzed and compared.Measured results show that the phase noise of oscillator with DGS reduced by 5 dB～7 dB in comparison with the oscillator without DGS.
出处
《微细加工技术》
2008年第6期31-33,共3页
Microfabrication Technology
基金
国家自然科学基金资助项目(60476035
60776052)
关键词
缺陷接地结构
相位噪声
倒扣芯片
毫米波振荡器
defected ground structure
phase noise
flip chip
millimeter-wave oscillator
