运用精益六西格玛降低分立器件芯片测试设备的故障率

Reduce the Use of Lean Six Sigma Discrete Chip Testing Equipment Failure Rate

目的:为了提高芯片测试工序的测试产能,通过改进分立器件芯片测试工序的设备管理与流程,降低生产设备的故障率。方法:采用精益六西格玛,并通过其定义、测量、分析、改进、控制5个步骤研究,改进我公司分立器件芯片测试工序的设备管理与流程。结果:设备故障率由改进前的2.5%降低到1.4%。结论:精益六西格玛可减少设备管理与流程中存在的缺陷,降低分立器件生产设备的故障率,以便进一步提高芯片测试产能和设备管理水平。

Objective: To improve the test process test chip production capacity through improved discrete chip testing equipment management processes and procedures to reduce the failure rate of production equipment. Methods: Using Lean Six Sigma,and through its definition, measure, analyze, improve, control 5 steps to study and improve my company discrete chip testing equipment management processes and procedures. Results: Improved equipment failure rate decreased to 2.5% before to 1.4%Conclusion: Lean Six Sigma to reduce device management and process defects, reduce discrete manufacturing equipment failure rate, in order to further improve productivity and chip testing equipment management.