摘要
采用紫外激光在多芯片微波组件上实现了镀金盒体的标识。分析了图形处理和激光能量对打标的影响。研究表明,激光沟道叠加填充方式实现了图像的无缝隙打标,通过原点和精确阵列模具的设计保证了标记的位置精度在±0.1 mm以内;另外,试验数据表明打标的最佳激光能量为0.8 W,此时标识清晰,激光蚀刻的厚度仅为0.24μm,;标识后的组件经过48 h的盐雾试验,未发现组件表层有腐蚀现象,满足产品要求。
Nondestructive markers were printed on microwave multi-chip modules(MMIC)whose package was gold-plated using UV laser. The effect of image processing and laser energy on makers was investigated. The results indicate that the marker image could be filled by laser beans, and the precision was controlled between ±0.1 mm by camera calibration and special precision fixtures. The etch depth was about 0.24μm when the laser energy was about 0.8 W. Additionally, corrosion phenomenon did not happened to the marked MMIC which was tested by salt spray method in 48 hours. All the results indicated that the batch processing could be realized.
出处
《电子与封装》
2014年第8期32-35,共4页
Electronics & Packaging
基金
国防基础科研项目(A1120132016)
关键词
多芯片微波组件
激光
标识
microwave multi-chip modules
laser
nondestructive marker
