军用电子装备应用中的塑封微电路质量保证

Analysis for the Application of Plastic Encapsulated Micro-circuit in Military Electronic Equipments

近年来,塑封微电路凭借着其在性能、重量、尺寸、成本、采购周期以及可获得性等方面的优势,越来越多地应用在军工电子装备中,其可靠性低的问题就越来越突出。如何将这类塑封微电路更可靠地应用于不同领域的军工电子装备中,并使风险降低到可控的范围,是广大军工电子装备制造单位正在致力探索解决的问题。浅析了塑封微电路应用于军工电子装备中的优缺点,并介绍了某型塑封微电路在地面、航空这两个不同的领域应用所执行的一套质量保证方案。

In recent years, the plastic encapsulated micro-circuit(PEM)have been more and more applied to military electronic equipments because of its advantages in performance, weight, size, cost, purchase cycle and availability. Nevertheless, its low-reliability problem is becoming more and more prominent. How to use these plastic encapsulated micro-circuits more reliably in different areas of the military electronic equipment and reduce risk to an acceptable range is the problem that all military electronic equipment manufacturers dedicate to solve. In the paper, the author introduced the advantages and disadvantages of the plastic encapsulated micro-circuit applied in military electronic equipment. On the other hand, a series of PEM quality assurance scheme for different application ifelds was introduced.