摘要
针对微电子组装中常见的BGA封装形式,对比采用3种不同成分的BGA焊球和焊膏组合(锡铅共晶焊球和锡铅共晶焊膏Sn63Pb37、Sn3Ag0.5Cu焊球和锡铅共晶焊膏以及Sn3Ag0.5Cu焊球和Sn3Ag0.5Cu焊膏)焊接得到的BGA焊接界面。经过不同周期的热疲劳试验后,在金相显微镜和电子背散射衍射下观察,发现Sn3Ag0.5Cu焊球和锡铅共晶焊膏混装形成的BGA焊点中黑色的富锡相均匀弥散分布在焊球内,在热循环载荷作用下极难形成再结晶,抗热疲劳性能最好。
BGA, the common packaging in the microelectronic assembly, was aimed in the paper. Three different component of solder joints of the combination of BGA solder ball and solder paste, which were tin-lead eutectic solder and tin-lead eutectic solder paste, Sn3.0Ag0.5Cu balls and tin-lead eutectic solder paste, and Sn3.0Ag0.5Cu balls and Sn3.0Ag0.5Cu solder paste, were studied. After different cycles of the thermal fatigue test, the solder joints were observed by the optical microscopy and the electron backscatter diffraction. It was found that the black tin-rich phase uniformly dispersed within the solder ball and it was extremely dififcult to form the recrystallization, which resulted that the solder joints formed by Sn3.0Ag0.5Cu balls and tin-lead eutectic solder paste performed the best thermal fatigue resistance.
出处
《电子与封装》
2015年第7期5-9 13,13,共6页
Electronics & Packaging
基金
国防基础科研项目(A1120132016)
关键词
BGA
热疲劳
再结晶
电子背散射衍射
BGA
thermal fatigue
recrystallization
electron backscatter diffraction
