密封测试中盖板结构对器件应力影响的有限元分析

Finite Element Analysis of Effects of Cover Plate Structure on Residual Stress of Device in Sealing Test Process

针对器件在密封检测过程中的失效现象,采用ABAQUS有限元模拟软件,建立失效器件外壳的密封试验三维仿真模型,分别对失效结构封装件和改进结构封装件进行密封测试环境下的应力计算分析。计算结果从理论上解释了失效结构在密封试验时易出现严重的因瓷件微裂纹或开裂引起的失效现象。盖板的结构直接影响外壳整体应力的形式,通过结构调整,封装件薄弱区(外壳瓷件区域)的拉应力仅为原结构的63.3%,表明通过盖板结构的改进可有效避免该类失效现象,对封装可靠性的设计有一定的指导意义。

For failure situations of devices in sealing test process, a 3D calculating model of failure situ-ation of devices in sealing test was established using ABAQUS finite element simulation software in the paper, and the stresses of failure structure and improved structure in sealing test were calculated and analyzed, respectively. The calculation results explained failure reason caused by micro cracks or cracking of ceramic in sealing test process, cover plate directly influenced the stress form of whole package.The tensile stress of weakness part (ceramic area) of improved structure was only about 63.3% of the original structure, and show that the failure situation could be effectively avoided through structural optimization of cover plate, while those results would provide more or less guiding for high reliability design of package.