单粒子翻转效应及加固技术的测试研究

Test research on single particle flip effect and reinforcement technology

针对高能粒子入射半导体材料引发的辐射效应,从实验平台的设计对地面辐射试验进行了研究。通过对单粒子翻转效应的分析,完成评估方式的制定。实验平台通过建立数据采集系统、数据分析系统,同时考察4种SRAM型的FPGA芯片在不同辐射源以及不同强度下对单粒子产生的影响。通过辐照试验,验证了试验方法、试验系统的有效性和可靠性,并掌握了试验数据的处理方法。实验结果表明,在高强度的辐照下,单粒子翻转效应显著增多,需要采取防护措施及时修正,对FPGA芯片的使用以及选型具有参考价值。

As it was difficult in the radiation effect induced by the high energy particle incident semiconductor materials, the ground radiation test was studied from the experimental platform.Based on the analysis of the single-event effect, the evaluating method is presented. Mainly consisted of data acquisition system and data analysis system,he experimental platform investigated the effects of four SRAM FPGA chips on single particles under different radiation sources and different intensities.Through the radiation test, the validity and reliability of the test method and test system are verified, and the processing method of test data is mastered.The experimental results show that the high strength, under the irradiation of single particle flip effect significantly increased, need to take protective measures in a timely manner, the use of FPGA chip and selection has reference value.