8Schubert E F, Light-Emitting Diodes[M]. Cambridge University Press,2006 :191.
9Arik M,Weaver S. Chip scale thermal management of high brightness packages[J]. Proc. of SPIE , 2004, 5530 : 214-223.
10Wong C P, Xu J, Zh L, et al. Recent advances on polymer nanocomposites for advanced electronic packaging applications[C]//IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 : 1-16.
