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高阻硅基铝硅合金弹性膜MEMS相移器 被引量:3

MEMS Phase Shifter with AlSi Alloy Membrane on High-Resistivity Silicon
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摘要 级联式 MEMS相移器可通过悬浮于共平面波导之上的微机械可调电容的变化 ,来改变传输线的特性阻抗和相速 ,达到相移的目的 .文中讨论了 MEMS相移器特性对微机械电容和下拉电压的要求 ,并通过轻质量的铝硅合金弹性膜 ,获得了较低的下拉电压 .测试结果表明 ,相移器的下拉电压不大于 4 0 V,且当控制电压大于 10 V时 ,即有明显的相移 .该 MEMS相移器制备于电阻率大于 4 0 0 0 Ω· cm的高阻硅衬底上 ,获得了较好的传输特性 ,在整个测试频段 1~ 4 0 GHz,S2 1 均小于 3d B,并在 2 5 V时获得了大于 2 5°的相移量 . The design and fabrication of low loss distributed MEMS phase shifter are presented.The principle for this phase shifter is that the phase velocity can be varied by mean of snapping down the membrane of MEMS loading capacitors of the transmission line.Its MEMS capacitors and control voltage are discussed in detail.Several different membranes are used as the membranes and Al 0.96 Si 0.04 alloy shows the best performance with pulling down voltage of the MEMS phase shifter no more than 40V.There is a phase shift when the control voltage is only 10V.With the phase shifter fabricated on the high resistivity silicon( ρ >4000Ω·cm),the insert loss is very low,no more than 3dB from 1GHz to 40GHz.The phase shift will be more than 25°at 25V.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2002年第9期972-976,共5页 半导体学报(英文版)
基金 国家 973计划 (No.G19990 3 3 10 5 ) 国家自然科学基金 (批准号 :698760 12 ) 国家杰出青年基金 (批准号 :69975 40 9) 上海应用材料研究与发展基金 (No.0 10 3 ) 上海市重点学科 (No.0 12 2 610 2 8)资助项目~~
关键词 铝硅合金弹性膜 MEMS相移器 高阻硅 HR-Si 下拉电压 MEMS phase shifter AlSi alloy membrane high resistivity silicon(HR Si) pull down voltage
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参考文献6

  • 1[1]Borgioli A,et al.Low-loss distributed MEMS phaseshifter.IEEE Microwave Guided Wave Lett,2000,10(1):7
  • 2[2]Hayden J S,et al.Low-loss cascadable MEMS distributed X-Band phase shifters.IEEE Microwave Guided Wave Lett,2000,10:142
  • 3[3]Wu Yunhong,et al.SiO2 interface layer effects on microwave loss of high-resistivity CPW line.IEEE Microwave Guided Wave Lett,1999,9(1):10
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  • 6[6]Scott B Net al.Distributed MEMS true-time delayphase shifters and wide-band switches.IEEE Trans Microw Theory Tech,1998,46(11):1881

同被引文献16

  • 1郭方敏 初建朋 赖宗声.第一届全国纳米技术与应用学术会议论文集[M].,2000.193.
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  • 7Zavracky P M, Majumder S, Mcgruer N E. Micromechanical switches fabricated using nickel surface micromachining. J Microelectromechan Syst, 1997,6 (1) : 3.
  • 8Jia Ming, Guo Fangmin, Zhu Ziqiang, et al. Theoretical study of surface MEMS RF switch structure. International Conference on Sensor Technology (ISTC-2001),2001:242.
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  • 10Barker N S,Rebriel G M.Distributed MEMS true-time delayphase shifter and wide-bandswitches.IEEE Trans Microw Theory Tech,1998,46(11):1881

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