摘要
利用 ANSYS软件以有限元分析的方法研究了 vf BGA器件内部芯片断裂问题 .通过建立模型和模型评价得到了适当的三维简化模型及导致芯片断裂的等效应力大小 .根据对测试过程的模拟预测找到了引起芯片断裂的原因 .研究发现 。
The ANSYS software is employed to analyze the inner die crack of vfBGA.A suitable 3D model and the minimum stress causing die crack are achieved by modeling and estimating.The crucial cause of inner die crack is predicted and found after the simulation of the test process.It is the great stress induced by the abnormal contact between the testing equipment and vfBGA unit that causes the inner die crack.
