面向表面组装工艺技术的PCB焊盘设计

The Design for PCB Land Responding to SMT

尽管电子设计类软件已相当先进和方便 ,而且更新速度也很快 ,但是仍然无法满足各个层次的设计人员的需求 ,特别是适应各种元件封装形式的焊盘设计库并不能让设计和制造者满意。为了在此方面对PCB设计有所帮助 ,从印制电路板焊盘的设计方法入手 ,针对表面组装工艺技术特点 ,分析了PCB焊盘对PCA可靠性的影响因素 ,并根据相关的质量要求提出了较为简便的设计方案。

Though the design software has been very advanced and convenient,and has been improving fast, it can't satisfy all the designer,especially no land library responding to all kinds of SMC/SMD.So analyze the influences of PCB land on the reliability of PCA,and according to the relative quality requirements,give some simple design method.