摘要
本文简要评逆相控阵用收发(T/R)组件的特点及发展概况,介绍了几种收发组件的电路,即混合微波集成电路(HMIC)、微型混合微波集成电路(MHMIC)以及单片微波集成电路(MMIC),并讨论了收发组件的制造工艺、电路组成、封装测试和成品价格。
This paper briefly reviews the features and development of T/R modules for phased array. Several fabrication technologies for T/R modules such as hybrid MIC(HMIC)miniature hybrid MIC (MHMIC)and monolithic MIC (MMIG) are introduced. And the fabrication technology, circuit configulation,packaging and testing, and cost of T/R modules are also discussed.
出处
《半导体情报》
1991年第1期47-54,F003,共9页
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