摘要
球栅阵列封装（BGA）是现代组装技术的一个新概念,它的出现促进了表面安装技术（SMT）与表面安装元器件（SMD）的发展和革新,并将成为高密度、高性能、多功能及高I/O引脚数封装的最佳选择。介绍了BGA的概念、发展现状、应用情况以及一些生产中应用的检测方法等,并讨论了BGA的返修工艺。
BGA is a new concept of contemporary assembly technology. BGA has advanced and innovated the SMT/SMD since it was appeared. It is believed that BGA will be the best choice of the IC with density, high performance, multiple function and high I/Os. This paper simply introduces the concept, development and application of BGA, and some test methods in the assembly process of ball grid array packaging component. The rework process for BGA is discussed.
出处
《电子产品可靠性与环境试验》
2002年第5期46-50,共5页
Electronic Product Reliability and Environmental Testing
