摘要
在IC封装设备中 ,由于直线导轨的扭摆 ,造成的封装工作台工作梁末端的定位误差 ,是使工作台定位精度降低的一个主要原因。由于IC封装的高速高精度特性 ,使一般的误差补偿系统无法在其上进行应用。本文讨论了一种基于压电陶瓷的新的误差补偿方法 ,该方法通过电涡流传感器对直线导轨偏摆误差进行测量 ,从而在末端用压电陶瓷微位移补偿系统进行偏摆误差补偿 。
Because of swing lead rail,working girder's tip of IC banding table have position error,which is the primary cause reducing work table position precision.As high speed and high precision characteristic of ICbanding,the generic error compensation system can't be applied.The paper discussed a new compensation way basing on PZT.Using inductive gauging sensor to measure the swing of lead rail,the method compensate the error of tip by PZT micro motion system.At last the paper has validated feasibility of precept.
出处
《自动化技术与应用》
2002年第5期56-58,共3页
Techniques of Automation and Applications
