D-KH法制备AgCuSn合金钎料的性能研究

Properties of AgCuSn Solder Alloy Prepared by D-KH Method

分别采用熔铸法和D-KH法(叠轧复合-扩散合金化工艺)制备了Ag-22.4Cu-20Sn钎料合金,采用XRD、SEM、DSC及万能力学试验机等测试技术,对合金相组成、显微组织、熔化特性、钎焊接头的剪切强度和钎焊界面形貌等进行了对比研究。结果表明,D-KH法制备的钎料相组成为(Ag)、Cu3Sn、Ag5Sn相,而熔铸法制备的钎料相组成为(Ag)、Cu3Sn、Ag5Sn以及Cu41Sn11相;D-KH法制备的钎料合金液固相线均降低,熔程减小。与熔铸法相比,用D-KH法制备得到的厚度0.1 mm的钎料薄带,润湿铺展性更优、接头剪切强度更高、接头强度稳定性更好。

Ag-22.4Cu-20Sn solder alloy was prepared by D-KH method and casting. XRD, SEM, DSC and mechanical testing were used to study phase compositions, microstructures, melting properties, shear strengths of brazed joints and other related properties in comparison with solder alloy prepared by casting.The results show that phases of Ag-22.4Cu-20Sn solder ribbon made by D-KH are (Ag),Cu3Sn and Ag5Sn while the phases of the solder made by casting are (Ag),Cu3Sn, Ag5Sn and Cu41Sn11. Thus in comparison with the solder made by casting the melting characteristics are so different, such as the solidus temperature to be lower and melting range were reduced. Under the same condition, the wetting and spreading properties of solder alloy made by D-KH with 0.1 mm thickness are super. Simultaneously, shear strength of the joint is higher and stability is better.