HCl-CuCl_2-NaClO湿法浸取手机元器件中的钯、金

Extraction of Pd,Au from Phone components in HCl-Cu Cl_2-Na Cl O solutions

通过HCl-Cu Cl2-Na Cl O湿法浸出体系对手机元器件中金属钯(Pd)、金(Au)进行浸出实验,研究不同因素对于Pd、Au浸出率的影响.结果显示,在2mol/L HCl、体积分数5%Na Cl O、0.075mol/L Cu Cl_2、固液比1%,反应温度60℃条件下,2h后Pd、Au浸出率均可达85%;结果表明,Cu^(2+)、Cl-、温度对于Pd的浸出率起很大作用,Na Cl O的加入可加快Pd浸出反应达到平衡速率;Na Cl O、温度对于Au的浸出率起关键作用,HCl、Cu^(2+)的加入可促进Au的浸出.因此,HCl-Cu Cl_2-Na Cl O湿法浸出体系对于Pd、Au具有良好的浸出效果.

A novel hydrometallurgical process for recovery of palladium and gold from phone components inHCl-CuCl2-NaClO leaching system was offered,different factors of Pd,Au leaching process were investigated.Theresults of experiment indicated that,on the condition of2mol/L HCl,5%NaClO,0.075mol/L CuCl2at333K for2h with asolid/liquid ratio of1/100,over85%of Pd and Au was leached.Cu2+,Cl-,the temperature for the Pd leaching rates playeda significant role.NaClO was added to solutions could accelerate the Pd leaching reaction rates;NaClO,the temperaturefor the Au leaching rates had a significant influence.The additions of HCl,Cu2+to promotes Au leaching.Therefore,HCl-CuCl2-NaClO leaching system for Pd,Au leaching have a positive effect.