电子辐照聚酰亚胺薄膜力学性能退化研究

MECHANICAL PROPERTY DEGRADATION OF POLYIMIDE FILM BY ELECTRON RADIATION

利用北京卫星环境工程研究所的空间综合辐照实验设备对聚酰亚胺(PI)薄膜空间电子辐射环境下的力学性能变化进行了研究,探讨了不同电子通量、电子注量和实验温度对聚酰亚胺薄膜力学性能的影响。研究发现,在相同通量下,随着辐照注量的增加,PI薄膜的拉力、抗拉强度和断裂伸长率先增加而后呈指数规律降低;在相同注量下,随着辐照通量的增加,拉力、抗拉强度逐渐增加,而断裂伸长率先减小再增大;在相同辐照注量下,随着温度的升高,薄膜的拉力、抗拉强度和断裂伸长率均增加。最后对电子辐照聚酰亚胺薄膜的力学性能退化机理进行了初步分析。

The mechanical property of polypyromellitimide film in electron radiation was studied inΦ800mm combinedspace radiation test facility in Beijing Institute of Space Environment Engineering(BISEE),and the influence offlux,fluence and temperature of electron radiation on the mechanical property of the film was studied.The following resultscan be obtained:the tensile force,tensile strength and rupture elongation of polyimide film decrease firstly and thenexponential increase with the increase of electron radiation fluencies.At the same electron radiation fluence,the tensileforce and tensile strength of polyimide film increase with the increase of electron radiation flux,but the rupture elongationdecrease firstly and then increase with the electron flux.The mechanical properties of polyimide film increase with the increaseof test temperature.