摘要
半导体致冷组件(器件)是电力电子产业的重要组成部分,行业要求专业性较强。半导体致冷(组件)器件的加工过程主要包括半导体切割、喷涂、组装、焊接4个关键环节。本文重点对加工过程中的喷涂环节,采用致冷晶片表面处理热喷涂工艺所产生的作用进行探讨。
Semiconductor cooling components(devices)is an important part of the power electronics industry,the industry requires strong professional.The process of semiconductor refrigeration device includes four key steps:cutting,spraying,assembling and welding.This paper focused on the analysis of the spraying process in the process,and the effect of the surface thermal spraying process on cooling chips.
作者
魏洪菊
张永强
Wei Hongju;Zhang Yongqiang(Xuchang City High-tech Technology Innovation Service Center Co., Ltd.,Xuchang Henan 461000;Xuchang City Supply and Marketing Cooperative,Xuchang Henan 461000)
出处
《河南科技》
2017年第7期90-91,共2页
Henan Science and Technology
关键词
半导体致冷
致冷晶片
热喷涂
技术要点
应用优势
semiconductor refrigeration
cooling chip
thermal spraying
technical points
application advantages
