PCB绝缘层感光树脂的固化工艺

Curing Process of Photosensitive Resin in Insulating Layer of Printed Circuit Boards

采用差示扫描量热分析法,研究了印制电路板(PCB)绝缘层树脂——感光改性环氧树脂预固化体系中固化剂2123型酚醛树脂和固化促进剂咪唑的合适配比。利用硅烷偶联剂对纳米SiO_2进行表面处理制得亲油性纳米SiO_2,将其掺入到感光改性树脂固化体系中以提高体系的热稳定性能。采用正交实验和单因素实验方法,研究了亲油性纳米SiO_2用量、固化最高温度、最高温度固化时间3个因素对该树脂体系固化产物在200℃的热降解量的影响。结果表明,感光改性环氧树脂/2123型酚醛树脂/咪唑最佳质量比为100/5/1.5,此时的固化反应最为完全;在掺杂纳米SiO_2的感光改性树脂的最佳固化工艺条件下,即当亲油性纳米SiO_2质量分数为5%,固化最高温度为120℃,最高温度固化时间为2 h时,固化产物的200℃热降解量为0.94%。

The optimum proportions of curing agent2123-type phenolic resin and curing accelerator imidazole in the pre-curingsystem of the PCB insulation resin--photosensitive epoxy resin were studied by differential scanning calorimetry method.Thesurface of the nano-silica was treated by silane coupling agent for preparing lipophilicity nano-silica.The lipophilicity nano-silicawas incorporated into the photosensitive resin curing system in order to improve the thermal stability of the system.The influences ofthe lipophilicity nano-silica content,highest curing temperature and curing time at the highest temperature on200℃thermal degradationof the photosensitive epoxy resin curing products were investigated and analyzed by orthogonal experiments and single factorexperiments.The results show that the optimal mass proportion of the photosensitive epoxy resin/2123-type phenolic resin/imidazoleis100/5/1.5,and the curing reaction is the most complete.It’s also showed under the optimum curing process,which thelipophilicity nano-silica content is5%,the highest curing temperature is120℃and the curing time at the highest temperature is2h,the200℃thermal degradation of the curing products is only0.94%.