摘要
研究了采用纯度为99.9%的In70Pb30合金作为焊料片的低温焊接技术,分析了焊接时候的影响因素:焊料片的影响、升温速率、焊接温度、真空度,通过采用甲酸对焊料片预处理去除氧化层,在215℃、5×10^(-7) torr的真空环境下进行了焊接,焊接后的样品采用X-ray、拉力测试系统、检漏仪测试了样品的孔洞率、焊接强度、漏率,结果表明:焊接后焊接区域合金均匀、无缝隙、孔洞率少、剪切力高、气密性好,能够满足非制冷焦平面的窗口封接的气密性要求。
The low temperature welding technology was studied by the use of the In70Pb30alloy with99.9%purity as welding pieces,the influencing factors during welding were analyzed:the influence of welding pieces,heating rate,welding temperature,vacuum degree,the welding pieces were pretreated by the use of formic acid to remove oxide layer,the welding was operated at215℃,5×10-7torr under the condition of vacuum,the samples of after welding were characterized by X-ray,pull test system,leakage detector to test the holes,the welding strength,the leakage rate of the samples,the results indicate that:the good homogeneity of alloy,seamless,less holes,high shear force and good air tightness in welding area after welding,those good properties make the samples satisfy the need of the air tightness of the window sealing of uncooled focal plane.
作者
袁俊
龚瑜
冯江敏
杨璇
太云见
何雯瑾
朱琴
普朝光
黎秉哲
YUAN Jun;GONG Yu;FENG Jiangmin;YANG Xuan;TAI Yunjian;HE Wenjin;ZHU Qin;PU Chaoguang;LI Bingzhe(Kunming Institute of Physics, Kunming 650223, China;Kunming Small & Medium Enterprises Service Centre, Kunming 650041, China)
出处
《红外技术》
CSCD
北大核心
2017年第7期659-663,共5页
Infrared Technology