摘要
在相关文件、文献、以及实践经验的基础上,找出高亮度模组设计之概论。为了使高亮度模组有可量产性,通过案例和实验数据,严重设计概论之正确性。另外,从技术发展和技术特性方面,介绍了高亮度模组的应用和发展方向。设计的主要内容包括研究和解决关键技术,技术路线包括工艺流程图、产品结构图、框架图等。采取直下式LED背光的设计,采用特殊的散热方式,使得液晶屏的亮度达到高亮以及超高亮的标准,可以实现在各种复杂光学环境下的良好的显示效果。
Based on the relevant documents and literature,and practical experience,find out high brightness of module design specification.In order to make the high brightness module with production,experimental data are in the market after the module modification of production test.In addition,the application and development of high brightness module made the market.The main contents of the design include the research and solution of key technology,including the process flow chart,product structure diagram,frame diagram and so on.The design of vertical LED backlight adopts a special way of heat dissipation,which makes the brightness of the LCD screen bright and ultra bright.It can achieve good display effect in a variety of complex optical environment.
作者
顾伟民
GU Weimin(GW Electric(Shanghai)Co., Ltd,Shanghai 201204, China)
出处
《集成电路应用》
2017年第8期30-35,共6页
Application of IC
基金
上海市科技型中小企业技术创新基金(15CT24D6700)
关键词
高亮度背光
LED
热辐射
热传导
high brightness backlight
LED
thermal radiation
heat conduction