毫米波多层结构表面贴装铁氧体环行器设计

Design of millimeter wave multilayer surface-mounted ferrite circulator

随着通讯技术的发展,阵列天线的应用导致环行器的需求量迅猛增加。为适应微波组件集成化的批量生产工艺要求,急需解决环行器表面贴装技术难题。环行器实现表贴结构形式,通常有三种工艺途径,即低温共烧(LTCF)、MENS和多层印制电路板(PCB)叠片工艺。阐述了8 mm多层PCB结构表贴式环行器的设计。采用带状线环行器的设计方案,电路制作在印制电路板上,利用多层PCB工艺进行制作。为了形成一体化,电路两面用金属化过孔连接。信号通过金属化过孔引到底面与端口线连接,形成表贴结构。通过仿真优化,在27~30 GHz的频率范围内,器件的损耗小于0.83 d B,隔离度大于15.5 d B,输入端口电压驻波比小于1.63。

With the development of communication technology,applications of array antenna result in a rapid increasing in demand for circulators.To meeting the mass production process demand for integrated microwave assemblies,the technical problem on surface mounted circulator needs to be resolved immediately.There are three process routes for surface mounting,or low temperature co-firing(LTCF),micro-electromechanical system(MEMS)and multilayer PCB structure.Strip line was used to design circulator,and the circulator is etched on the printed circuit board.To achieve integration,the two sides of the circulator are connected by metallized hole.Signal goes through the metalized hole and reaches the ground port,forming the surface-mounted structure.By simulation optimization,the designed circulator features a loss less than0.83dB,an isolation broader than15.5dB,and an input VWSR less than1.63in frequency between27GHz and30GHz,.