摘要
研究发现Ni-Ti合金能够在电子组件机械气密封装领域发挥重要作用。为此,开展了某型Ni-Ti基合金机械气密封装方法研究,并在行业内首次设计了Ni-Ti基合金机械气密封装结构,该结构包含某型Ni-Ti基合金环、销钉柱和腔体壁。通过开展厚度分别为2.0,1.5,1.0,0.5和0.25 mm腔体壁的Ni-Ti基合金样件气密封装和环境试验验证后,表明:基于Ni-Ti基合金的机械气密封装方法切实可行,工艺实现难度不大。其中,腔体壁厚为0.5mm和0.25 mm的销钉柱气密性最容易满足GJB548B—2005的验收要求,且成品率可达100%。
Recent studies show that Ni-Ti alloys play an important role in the field of electronic components mechanical hermetic packaging(MHP).For this purpose,the study of MHP method of Ni-Ti alloys was discussed.An innovative design based on a certain type of Ni-Ti alloys was proposed.It includes a certain type Ni-Ti alloy ring,stainless steel column and cavity wall.Process tests and environment tests on cavity wall samples of the thickness with2.0,1.5,1.0,0.5and0.25mm were conducted.Results show that MHP method based on Ni-Ti alloy is feasible and the implement of this technology is not difficult.Thicknesses of0.5mm and0.25mm cavity hermeticity is be easily to meet the criteria of GJB548B-2005,and the rate of finished products can be reached100%.
作者
海洋
HAI Yang(No.10 Research Institute, China Electronic Technology Group Corporation, Chengdu 610036, China)
出处
《电子元件与材料》
CAS
CSCD
2017年第9期22-25,共4页
Electronic Components And Materials
关键词
Ni-Ti基合金
机械气密封装
合金环
方法
热处理
电子封装
Ni-Ti alloys
mechanical hermetic encapsulation (MHP)
alloy ring
method
heat-treatment
electronic package
